Verification outfit Avery Design Systems has teamed up with high-speed connectivity IP innovator CoMira Solutions to enable chiplet design using the UCIe (Universal Chiplet Interconnect Express) die-to-die interface standard.
The idea is that by combining Avery’s verification IP (VIP) and functional verification platform and CoMira’s high-speed protocol stack controller technology you will get a good method of designing and verifying multi-die systems using the UCIe standard.
For those who came in late, UCIe was announced earlier this year as a mean to provide interoperability of chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.
