It appears that Apple is set to release three more iPhones in the second half of this year.
Informed sources have leaked details of the models to Taiwanese wire Digitimes.
It reports that the phones will be the iPhone 6S, the iPhone 6S Plus and a four inch device currently codenamed the iPhone 6C.
Each of the phones will use Corning Gorilla Glass come with LTPS panels and while the 6S series will use Apple’s A9 chips, the 6C will use A8 microprocessors. They’ll all be kitted out with NFC as well as fingerprint scanners.
Digitimes also reports that Taiwanese firms Wistron, Foxconn and Pegatron will manufacture the handsets.
Meanwhile the same wire reports that chip foundry TSMC will fabricate the chips for the 6S and 6C.
