LG said it has encountered no overheating problems with Qualcomm Snapdragon processor and it will be powering a curved screen G Flex2 smartphone later this month.
Woo Ram-chan, LG vice president for mobile product planning, said that he was aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory.
The comment came after Bloomberg reported a day earlier that Samsung Electronics, the world’s top smartphone maker, decided not to use the new Qualcomm processor for the next flagship Galaxy S smartphone after the chip overheated during testing. To be fair, Samsung and Qualcomm have declined to comment on the record about the reason for Samsung abandoning the chip. Sources which cite overheating are so far unnamed.
Samsung is widely expected to unveil the new Galaxy S smartphone in early March, and Bloomberg reported that the Korean firm will use its own processors instead.
Woo said on Thursday that internal tests for the G Flex2, powered by the new Qualcomm processor, show that the new product emits less heat than other existing devices. The new phone is scheduled to start selling in South Korea on January 30.
He said he didn’t understand why there is a heat problem with the Galaxy S that his phone does not have.